Download - Call for Software Industry Papers: PDF

The International Systems and Software Product Line Conference (SPLC) is a premier forum where researchers, practitioners, and educators can present and discuss the most recent ideas, trends, experiences, and challenges in the area of software and system product lines engineering.

The 20th SPLC will take place in Beijing, China, September 19-23, 2016.

For more than a decade, organizations have been taking advantage of software product line practices to achieve business advantages in time to market, cost, quality, and agility. They have encountered a wide range of challenges, successes, and adaptations in their software product line experience. In addition, more and more organizations are opening up products and platforms to external contributions, to leverage the innovation power and network effects of software ecosystems.

We are seeking contributions from industry that share their challenges, successes, and adaptations of existing practices in all stages of maturity.


Abstract Submission: March 7, 2016 (extended!)

Paper Submission: March 18, 2016 (extended!)

Notification of Acceptance: April 25, 2016

Camera-ready Paper Due: May 23, 2016

Conference: Sept. 19-23, 2016


Topics include but are not limited to:

  • Introducing PLE to an organization
  • Software ecosystems and supply chains in industry context
  • Business ecosystems around product line engineering
  • Process issues, e.g. combining PLE with agile processes
  • Scoping of product/solution portfolios and assets
  • Product line architectures, design, validation and assessment
  • Variability management in and between all stages of the life-cycle
  • Guidance and governance PLE tools and methods
  • Product line testing, version and configuration management
  • Disruptive innovations and its effects on software product line
  • Non-traditional applications of product line concepts


  • Full papers reporting experience from industrial applications and projects. The papers in this category must provide sufficient context of the problems identified or addressed, describe clear requirements and/or experience in solving them, provide an assessment of benefits and drawbacks or other lessons learned, and explain why the contribution is innovative or valuable for others.
  • Short papers describing, from an industrial perspective, early returns on new product line and software ecosystem applications and projects, or other shorter industry topics of interest.

The page limit is 10 pages for full papers and 5 pages for short papers. Submissions should follow the ACM SIGS proceedings format and will be reviewed by at least three members of the SPLC 2016 Industry Track program committee.

The SPLC proceedings will be published by ACM in the ACM Digital Library within its International Conference Proceedings Series.




SPLC 2016 General Chair:

  • Hong Mei, Shanghai Jiao Tong University, China

Research Chairs:

  • Christoph Elsner, Siemens AG, Germany
  • Yun Xie, Digital China, China

Local Chair:

  • Dan Hao, Peking University, China

Publicity Chairs:

  • David Benavides, University of Sevilla, Spain
  • Leopoldo Teixeira, Federal University of Pernambuco, Brazil
  • Jiangtao Wang, Peking University, China


  • Vander Alves, University of Brasília, Brazil
  • Michail Anastasopoulos, Facelift BBT, Germany
  • Michael Atighetchi, BBN Technologies, USA
  • Martin Becker, Fraunhofer IESE, Germany
  • Danilo Beuche, pure-systems GmbH, Germany
  • Jan Bosch, Chalmers University of Technology, Sweden
  • Deepak Dhungana, Siemens AG, Austria
  • Zheng Dong, Shenzhen Meilizhi Technology CO.LTD, China
  • John Favaro, Intecs SpA, Italy
  • Iris Groher, Johannes Kepler University Linz, Austria
  • Øystein Haugen, Østfold University College, Norway
  • Michael Kircher, DATEV eG, Germany
  • Tomoji Kishi, Waseda University, Japan
  • Ronny Kolb, Honeywell International Sarl, Switzerland
  • Jérôme Le Noir, Thales Research and Technology, France
  • Martin Lehofer, Siemens AG, USA
  • Jörg Liebig, Method Park Software AG, Germany
  • Steve Livengood, Fitbit Inc., USA
  • Min Ni, Yonyou Network CO.LTD, China
  • Natsuko Noda, Shibaura Institute of Technology, Japan
  • Christian Prehofer, LMU München, Germany
  • Andreas Rummler, SAP AG, Germany
  • Ramesh S., General Motors, USA
  • Krzysztof Sierszecki, Danfoss Drives, Denmark
  • Julio Sincero, Accenture, Germany
  • Hailong Sun, Beihang University, China
  • Juha-Pekka Tolvanen, MetaCase, Finland
  • Bruce Trask, MDE Systems, USA
  • Frank Van Der Linden, Philips Healthcare, The Netherlands
  • Rob van Ommering, Philips Research, The Netherlands
  • Markus Voelter, Independent, Germany
  • Hironori Washizaki, Waseda University, Japan
  • Gang Yin, National Univ. of Defense Technology, China